DISCO
Precision wafer and package processing equipment
Supplies grinding, polishing, dicing, and related precision-processing equipment and consumables.
What public evidence supports
DISCO technical material describes wafer backgrinding, stress relief, blade and laser singulation, and die-strength considerations.
Evidence boundary
Equipment capability must be qualified against the wafer stack, street, thickness, die-strength target, and contamination controls.
Linked process capabilities
The links below show where the documented capability fits in the chip lifecycle. They are not customer or qualification claims.
Process
Silicon wafer preparation
How electronic-grade silicon becomes a flat, polished, oriented, and qualified substrate for device fabrication.
Process
Thinning & dicing
How finished wafers are protected, back-ground, stress-relieved, singulated, inspected, picked, and transferred without damaging thin die.
Sources
- [1]Semiconductor and Wafer Manufacturing Process · DISCO · accessed 2026-08-13
- [2]Silicon Wafer Thinning, the Singulation Process, and Die Strength · DISCO · 2016 · accessed 2026-08-13
Evidence basis
Evidence basis: Official first-party documentation. This page describes the supplier’s own published claims and does not independently verify performance, reliability, yield or comparative advantage.
What the document records
That DISCO publishes equipment lines for dicing, laser dicing, grinding, polishing, wafer mounting, inspection, die separation, surface planing and waterjet cutting, organised around cutting, grinding and polishing processes.
What it does not establish
The page carries no throughput, yield or reliability figures, no comparison with any other supplier, and no publication date. It establishes what DISCO lists, not how any machine performs or whether any line is currently available.
Source
DISCO Corporation, Products · Product Information and Solutions sections · undated page · https://www.disco.co.jp/eg/products/index.html · inspected 2026-09-02